Author:
Lee Moon Soo,Baick In Hak,Lee Minwoo,Kim Byungwook,Lee Miji,Kang Hanbyul,Kim Jinseok,Rhee Hwasung,Pae Sangwoo
Cited by
1 articles.
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1. An Improved Mold Flow Optimization Technology for High-Density Power Modules;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10