An Improved Mold Flow Optimization Technology for High-Density Power Modules-Reference-Cited by-同舟云学术

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An Improved Mold Flow Optimization Technology for High-Density Power Modules

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Yang Li¹,Cai Zhikuang¹,Xu Binbin²,Huang Shoukun²,Liu Lu¹

Affiliation:

1. Nanjing University of Posts and Telecommunications,The College of International Circuit Science and Engineering National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology,Nanjing,China

2. Nanjing University of Posts and Telecommunications,Nantong Institute of Nanjing University of Posts and Telecommunications,Nanjing,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873411.pdf?arnumber=9873411

Reference10 articles.

1. Molding process development for Low-Cost MEMS-WLCSP with silicon pillars and Cu wires as vertical interconnections

2. Characterization of Dual Side Molding SiP Module

3. Lamination of dry film epoxy molding compounds for 3D packaging: advances and challenges

4. Two-Phase Flow Simulation of Molded Underfill Process to Mitigate Void and Assure Reliability at Product Level

5. Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mold Flow Strategy Improvement for Power Module;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

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