Vacuum effect on the void formation of the molded underfill process in flip chip packaging-Reference-Cited by-同舟云学术

Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Published:2015-02 Issue:3-4 Volume:55 Page:613-622
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Guo Xue-Ru,Young Wen-Bin

Funder

National Science Council in Republic of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Flow time measurements for underfills in flip-chip packaging;Wang;IEEE Trans Compon Packaging Technol,2005

2. A theoretical analysis of the concept of critical, clearance toward a design methodology for the flip-chip package;Wan;J Electron Packag,2007

3. Study on bump arrangement to accelerate the underfill flow in flip-chip packaging;Lin;IEEE Trans Compon Packaging Manuf,2013

4. Effect on filling time for a non-newtonian flow during the underfilling of a flip chip;Young;IEEE Trans Compon Packaging Manuf,2011

5. Molded underfill (MUF) technology for flip chip packages in mobile applications;Joshi;Electron Compon Technol Conf,2010

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3. Parametric Study on the Void Risk in FC-POP Molded Underfill Process Using a Novel Porous Media, Two-Phase, Compressible Flow Simulation Method;IEEE Transactions on Device and Materials Reliability;2020-06

4. PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices;2019 IEEE International Integrated Reliability Workshop (IIRW);2019-10

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