Effect of helium dilution during plasma‐enhanced deposition on electron trapping in silicon dioxide thin films

Author:

Park Y. C.,Johnson N. M.,Jackson W. B.,Stevens K. S.,Smith D. L.,Hagstrom S. B.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Reference9 articles.

1. See for example,Proceedings of the Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films, edited by V. J. Kapoor and K. T. Handkins, Electrochemical Soc.87–10, (1986), and references therein.

2. III-V compound semiconductor insulated gate field effect transistors

3. Formation of thin film dielectrics by remote plasma-enhanced chemical-vapor deposition (remote PECVD)

4. Plasma-enhanced CVD of high quality insulating films

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1. Hydrogen in Ultralow Temperature SiO2for Nanocrystalline Silicon Thin Film Transistors;MRS Proceedings;2004

2. Physical and electrical properties of low temperature (<100 °C) SiO2 films deposited by electron cyclotron resonance plasmas;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2003-05

3. Thin-Film Deposition Materials;Handbook of Chemicals and Gases for the Semiconductor Industry;2002-07-15

4. Remote Plasma‐Enhanced Chemical Vapor Deposition of SiO2 Using Ar/  N 2 O  and SiH4;Journal of The Electrochemical Society;1998-11-01

5. Deposited silicon nitride with low electron trapping rates;Journal of Applied Physics;1993-07

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