An electromigration model that includes the effects of microstructure and temperature on mass transport
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.353807
Reference22 articles.
1. Linewidth dependence of electromigration in evaporated Al‐0.5%Cu
2. A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes
3. Monte Carlo calculations of structure‐induced electromigration failure
4. A model for linewidth‐dependent electromigration lifetime and its application to design rule scaling for narrow interconnects
5. A model for the effect of line width and mechanical strength on electromigration failure of interconnects with “near-bamboo” grain structures
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electromigration mechanisms in Cu nano-wires;2010 IEEE International Reliability Physics Symposium;2010
2. An analysis of the weakest-link model for early electromigration failure;Journal of Physics D: Applied Physics;2004-07-01
3. Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization;Journal of Applied Physics;2003-01-15
4. Fabrication of nanocontacts for molecular devices using nanoimprint lithography;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002
5. Electromigration in YBa2Cu3O7−δ using a metal clad near-field scanning optical microscope probe;Applied Physics Letters;2000-10-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3