Dynamic precipitation processes of Al2Cu in Al‐Cu thin films byin situtransmission electron microscopy
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.111046
Reference12 articles.
1. Microcorrosion of Al–Cu and Al–Cu–Si alloys: Interaction of the metallization with subsequent aqueous photolithographic processing
2. Reactive ion etching induced corrosion of Al and Al‐Cu films
3. Multilevel Interconnects For Integrated Circuits With Submicron Design Rules
4. Formation of second phase particles in aluminum-copper alloy films
5. The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation
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1. Transmission electron microscopy characterization of Al2Cu precipitate growth kinetics by in situ heat treatment;Vacuum;2008-09
2. Morphology evolution in TiN/Al–0.5Cu/Ti interconnection during chamber long stay and post-deposition annealing correlated to defect formation in metallization processing;Microelectronic Engineering;2008-07
3. Pipe-diffusion ripening of Si precipitates in Al-0.5%Cu-1%Si thin films;Philosophical Magazine;2005-10-21
4. Effect of Si addition on the precipitation of Al2Cu-phase in Al-Cu-Si thin films;Journal of Materials Science;2005-08
5. Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films;Microelectronic Engineering;2003-11
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