Microcorrosion of Al–Cu and Al–Cu–Si alloys: Interaction of the metallization with subsequent aqueous photolithographic processing-Reference-Cited by-同舟云学术

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Microcorrosion of Al–Cu and Al–Cu–Si alloys: Interaction of the metallization with subsequent aqueous photolithographic processing

Published:1990-05 Issue:3 Volume:8 Page:2025-2032
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Weston D.,Wilson S. R.,Kottke M.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.576800

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transmission electron microscopy characterization of Al2Cu precipitate growth kinetics by in situ heat treatment;Vacuum;2008-09

2. Morphology evolution in TiN/Al–0.5Cu/Ti interconnection during chamber long stay and post-deposition annealing correlated to defect formation in metallization processing;Microelectronic Engineering;2008-07

3. Effect of Si addition on the precipitation of Al2Cu-phase in Al-Cu-Si thin films;Journal of Materials Science;2005-08

4. Al-Cu-Si (Aluminium - Copper - Silicon);Light Metal Systems. Part 2;2005

5. Precipitation of Al2Cu in blanket Al-Cu films;Journal of Applied Physics;1997-10-15

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