Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1585119
Reference21 articles.
1. Electromigration in copper conductors
2. Electromigration saturation in a simple interconnect tree
3. Experimental characterization and modeling of the reliability of interconnect trees
4. Electromigration path in Cu thin-film lines
5. Microstructure and electromigration in copper damascene lines
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