Experimental characterization and modeling of the reliability of interconnect trees
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1330547
Reference13 articles.
1. Electromigration saturation in a simple interconnect tree
2. Stress evolution due to electromigration in confined metal lines
3. A hierarchical reliability analysis for circuit design evaluation
4. Methodology for electromigration critical threshold design rule evaluation
5. Electromigration path in Cu thin-film lines
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