Laser-heating wire bonding on MEMS packaging
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://scitation.aip.org/deliver/fulltext/aip/journal/adva/4/3/1.4867100.pdf?itemId=/content/aip/journal/adva/4/3/10.1063/1.4867100&mimeType=pdf&containerItemId=content/aip/journal/adva
Reference12 articles.
1. Improving the wire bonding process quality using statistically designed experiments
2. Effect of wire diameter on the thermosonic bond reliability
3. Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes
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