1. 1) M. Lapedus: "Wirebond Technology Rolls On," SEMICONDUCTOR ENGINEERING, May 2017
2. 4) Amkor Technology: "High Reliability Challenges with Cu Wire Bonding for Automotive Devices in the AEC-Q006," IEEE 67th Electronic Components and Technology Conference, May 2017
3. 5) Texas Instruments: "TI Manufacturing of Copper Bond Wire PEMs Challenges and Mitigation," Jun. 2018
4. 6) University of Paderborn, University of Bielefeld, Hesse GmbH, Infineon Technologies: "Modeling the ultrasonic softening effect for robust copper wire bonding," 2014
5. 7) University of Waterloo: "More Uniform Pd Distribution in Free-Air Balls of Pd-Coated Cu Bonding Wire using Movable Flame-off Electrode," Microelectronics Reliability 55, 2015