More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode-Reference-Cited by-同舟云学术

More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Published:2015-01 Issue:1 Volume:55 Page:201-206
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ly Nhat,Xu Di Erick,Song Wan Ho,Mayer Michael

Funder

NSERC

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Fine pitch copper wire bonding in high volume production;Appelt;Microelectron Reliab,2011

2. Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding;Pequegnat;Microelectron Reliab,2011

3. Study of factors affecting the hardness of ball bonds in copper wire bonding;Zhong;Microelectron Eng,2007

4. Wire bonding in microelectronics;Harman,2010

5. Enhancing bondability with coated copper bonding wire;Uno;Microelectron Reliab,2011

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