Author:
Cheng L.X.,Liu M.R.,Wang X.Q.,Yan B.H.,Li G.Y.
Funder
Planned Science and Technology Project of Guangdong Province, China
Natural Science Foundation of Guangdong Province, China
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Laser-heating wire bonding on MEMS packaging;Liu;AIP Adv.,2014
2. Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging;Marauska;Microsyst. Technol.,2013
3. Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200mm MEMS wafer level hermetic packaging;Garnier;J. Mater. Sci.: Mater. Electron.,2013
4. A novel technique for MEMS packaging: reactive bonding with integrated material systems;Braeuer;Sens. Actuators A: Phys.,2012
5. Wafer bonding techniques for MEMS;Miki;Sens. Lett.,2005
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