Author:
Marauska S.,Claus M.,Lisec T.,Wagner B.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Agarwal R, Zhang W, Limaye P, Ruythooren W (2009) High Density Cu-Sn TLP Bonding for 3D Integration. Proc. IEEE 59th Electronic Components and Technology Conference pp 345–349
2. Baum M, Hofmann L, Wiemer M, Geßner T (2009) Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging. Proc. 3rd Mikrosystemtechnik Kongress
3. Bosco NS, Zok FW (2004) Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system. Acta Mat 52:2965–2972
4. Cain SR, Wilcox JR, Venkatraman R (1997) A diffusional model for transient liquid phase bonding. Acta Mater 45:701–707
5. Cao Y, Ning W, Luo L (2009) Wafer-level package with simultaneous tsv connection and cavity hermetic sealing by solder bonding for MEMS device. IEEE Trans Electron Packag Manuf 32:125–132
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