A novel technique for MEMS packaging: Reactive bonding with integrated material systems

Author:

Braeuer J.,Besser J.,Wiemer M.,Gessner T.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. 3D integration technology: status and application development;Ramm;Proc. of the ESSCIRC,2010

2. Handbook of 3D Integration – Technology and Applications of 3D Integrated Circuits;Garrou,2008

3. Semiconductor Wafer Bonding: Science and Technology;Tong,1998

4. Wafer Bonding Applications and Technology;Alexe,2004

5. Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging;Cheng;J. Microelectromech. Syst.,2006

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