High dislocation density of tin induced by electric current
Author:
Affiliation:
1. Department of Material Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, R. O. C
2. Department of Chemical and Material Engineering, National Central University, Jhongli 32001, Taiwan, R. O. C
Funder
Ministry of Science and Technology, Taiwan (MOST)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4937909
Reference18 articles.
1. Electromigration induced resistance decrease in Sn conductors
2. Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
3. Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing
4. Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing
5. Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration
Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Theoretical upper limit of dislocation density in slightly-ductile single-crystal ceramics;Journal of Physics: Condensed Matter;2023-08-10
2. Electrorecrystallization of Invar 36 alloy;Materials Today Communications;2023-06
3. Dynamic recrystallization and twinning behavior of magnesium alloy during hot tension;Journal of Materials Research and Technology;2023-05
4. Influence of dislocations on ionic conductivity and dendrite formation in solid electrolytes;Physica Scripta;2023-03-14
5. Strengthening of Inconel 600 alloy with electric current stressing;Materialia;2023-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3