Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
2. Interstitial Diffusion of Copper in Tin
3. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
4. Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing
5. Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing
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3. Solidification behavior of Sn crystals − Under different temperature gradients;Materials Today Communications;2024-03
4. Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation;Applied Physics Letters;2023-12-04
5. Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration;Materials Characterization;2023-11
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