Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2714100
Reference16 articles.
1. Surface Mount International Conference and Exposition, SMI 98 Proceedings;Brandenbery S.
2. Electromigration of eutectic SnPb solder interconnects for flip chip technology
3. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
4. Electromigration studies on Sn(Cu) alloy lines
5. Electromigration in Pb-free flip chip solder joints on flexible substrates
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