Electromigration in Pb-free flip chip solder joints on flexible substrates
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2163982
Reference15 articles.
1. Effect of substrate flexibility on solder joint reliability
2. Reliable Au-Sn flip-chip bonding on flexible prints
3. Characteristic study of anisotropic-conductive film for chip-on-film packaging
4. Optimizing Vibration Isolation of Flex Circuits in Hard Disk Drives
5. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling
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