Reliable Au-Sn flip-chip bonding on flexible prints-Reference-Cited by-同舟云学术

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Reliable Au-Sn flip-chip bonding on flexible prints

Published:1995-05 Issue:2 Volume:18 Page:257-263
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

Baggerman A.F.J.,Batenburg M.J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/96/8757/00386258.pdf?arnumber=386258

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The structural, elastic, thermodynamic, and electronic properties of (Cu6-xAux)Sn5 (x = 0, 0.5, 1, 1.5, 2) intermetallic compounds;Indian Journal of Physics;2020-10-27

2. Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging;Journal of Materials Science: Materials in Electronics;2017-05-17

3. Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion;Journal of Electronic Materials;2014-05-28

4. Phase Diagrams and Their Applications in Pb-Free Soldering;Lead-Free Solders: Materials Reliability for Electronics;2012-03-15

5. Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations;Microelectronics Reliability;2012-02

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