Interface deciphering for highly interfacial adhesion and efficient heat energy transfer

Author:

Wang Shuting1,Jiang Zhenghong1,Ren Linlin1,Zeng Xiaoliang1ORCID,Sun Rong1

Affiliation:

1. National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China

Abstract

Interfacial adhesion and interfacial thermal resistance (ITR) are two critical factors in the interfacial force and energy transfer, but it is difficult to simultaneously achieve the desirable interfacial adhesion and ITR. Here, we overcome this challenge by fabricating an elastomer composite consisting of polydimethylsiloxane (PDMS) and micro-scale spherical aluminum (Al) fillers, which offers the high adhesion strength (1.28 MPa), high interfacial adhesion energy (528.4 J/m2), and low ITR (0.028 mm2·K/W) between the PDMS/Al elastomer composite and substrates. We further propose a quantified physical model to establish the relationship between interfacial adhesion and ITR for low phonon mismatch interfaces. This work will contribute to the development of interface science and guide the regulation of force and energy transfer at interface for wide range applications, such as electronic packaging, thermal storage, sensors, and medicine.

Funder

National key R&D project from ministry of science and technology of china

National Nature Science Foundation of China

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Shenzhen science and technology research funding

Key project of science and technology of Changsha

Guangdong provincial key laboratory

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

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