Weaker bonding can give larger thermal conductance at highly mismatched interfaces
Author:
Affiliation:
1. Department of Mechanical Engineering, The University of Tokyo, Tokyo, Japan.
2. Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
Abstract
Funder
Japan Society for the Promotion of Science
Core Research for Evolutional Science and Technology, Japan Science and Technology Agency
Publisher
American Association for the Advancement of Science (AAAS)
Subject
Multidisciplinary
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