Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications-Reference-Cited by-同舟云学术

Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications

Published:2019-07-08 Issue:29 Volume:11 Page:26507-26517
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Chang Guo,Sun Fangyuan¹,Wang Luhua²,Che Zhanxun¹,Wang Xitao³,Wang Jinguo²,Kim Moon J.²,Zhang Hailong^ORCID

Affiliation:

1. Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190, China

2. Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States

3. Shandong Provincial Key Laboratory for High Strength Lightweight Metallic Materials, Advanced Materials Institute, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250014, China

Funder

National Youth Science Foundation

University of Texas System

Youth Innovation Promotion Association of the Chinese Academy of Sciences

National Natural Science Foundation of China

State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b08106

Reference66 articles.

1. Molecular dynamics simulation of interfacial thermal conductance between silicon and amorphous polyethylene

2. Bonding-induced thermal conductance enhancement at inorganic heterointerfaces using nanomolecular monolayers

3. Thermal conductance of interfaces between highly dissimilar materials

4. Graphite Nanoplatelet−Epoxy Composite Thermal Interface Materials

5. Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

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