Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction-Reference-Cited by-同舟云学术

Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction

Published:2024-05-14 Issue:21 Volume:24 Page:6386-6394
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Zeng Xiangliang¹^ORCID,Liang Ting²³,Cheng Xiaxia²^ORCID,Fan Jianfeng²^ORCID,Pang Yunsong²^ORCID,Xu Jianbin³^ORCID,Sun Rong²^ORCID,Xia Xinnian¹,Zeng Xiaoliang²^ORCID

Affiliation:

1. College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People’s Republic of China

2. State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People’s Republic of China

3. Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong SAR 999077, People’s Republic of China

Funder

National Key Research and Development Program of China

Basic and Applied Basic Research Foundation of Guangdong Province

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Science, Technology and Innovation Commission of Shenzhen Municipality

National Natural Science Foundation of China

Shenzhen-Hong Kong Joint Funding Project of Shenzhen Collaborative Innovation Technology Project

Guangdong Provincial Key Laboratory

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.4c01409

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