Imaging setup for temperature, topography, and surface displacement measurements of microelectronic devices
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1520316
Reference11 articles.
1. Thermomechanical deformation imaging of power devices by electronic speckle pattern interferometry (ESPI)
2. Strain/stress measurements using electronic speckle pattern interferometry
3. Optical method for the measurement of the thermomechanical behaviour of electronic devices
4. High resolution photothermal imaging of high frequency phenomena using a visible charge coupled device camera associated with a multichannel lock-in scheme
5. Real-time reflectivity and topography imagery of depth-resolved microscopic surfaces
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3. Subsampling phase retrieval for rapid thermal measurements of heated microstructures;Optics Letters;2016-07-06
4. A methodology for nanosecond (or better) time resolved thermoreflectance imaging with coherence control of laser pulses;Applied Physics Letters;2013-05-20
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