Optical method for the measurement of the thermomechanical behaviour of electronic devices-Reference-Cited by-同舟云学术

Optical method for the measurement of the thermomechanical behaviour of electronic devices

Published:1999-06 Issue:6-7 Volume:39 Page:981-985
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Dilhaire S.,Jorez S.,Cornet A.,Schaub E.,Claeys W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. High Resolution Interferometry (HRI) and Electronic Speckle Pattern Interferomery (ESPI) applied to the thermomechanical study of MOS power transistor;Nassim,1998

2. Use of Electronic Speckle Pattern Interferometry (ESPI) in the measurement of static and dynamic surface displacement;Wykes;Optical Engineering,1982

3. Electronic Speckle Pattern Interferometry (ESPI);Sharp;Optics and Lasers in Engineering,1989

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