Strain Field Analysis in Electronic Components by ESPI: Bad Thermal Contact and Damage Evaluation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/article/10.1007/s10921-018-0466-4/fulltext.html
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3. Shkarayev, S., Madenci, E., Ibnabdeljalil, M., Savruk, M.P.: Analytical stress singularities for a crack at a Bi- or triple junction of dissimilar materials with bilinear behaviour. Eng. Fract. Mech. 68, 475–486 (2001)
4. Gu, Y., Nakamura, T., Chen, W.T., Cotterell, B.: Interfacial delamination near solder bamps and UBM in flip-chip packages. J. Electron. Packag. 123(3), 295–301 (2000)
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