Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4821427
Reference52 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Electromigration in Flip Chip Solder Joints
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
4. J. H. Lau, Flip Chip Technology (McGraw-Hill, New York, 1996), p. 123.
5. Lead-free Solders in Microelectronics
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