Electromigration in Flip Chip Solder Joints
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Publisher
Springer New York
Link
http://link.springer.com/content/pdf/10.1007/978-0-387-38892-2_9.pdf
Reference22 articles.
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4. T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, “Electromigration of eutectic SnPb solder interconnects for flip chip technology,” J. Appl. Phys., 89, 3189–3194 (2001).
5. T. Y. Lee, K. N. Tu, and D. R. Frear, “Electromigration of eutectic SnPb and SnAgCu flip chip solder bumps and under-bump-metallization,” J. Appl. Phys., 90, 4502–4508 (2001).
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