Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration-Reference-Cited by-同舟云学术

Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration

Published:2016-04-15 Issue:12 Volume:31 Page:1793-1800
ISSN:0884-2914
Container-title:Journal of Materials Research
language:en
Short-container-title:J. Mater. Res.

Author:

Guo Fu,Liu Qian,Ma Limin,Zuo Yong^ORCID

Abstract

Funder

Beijing Nova Program

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis

2. Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration

3. Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints;Wei;J. Mater. Sci.: Mater. Electron.,2015

4. Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints

5. Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient

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1. Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints;Scientific Reports;2024-07-08

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3. The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys;Journal of Electronic Materials;2023-12-06

4. Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties;Metals;2023-08-16

5. Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration;Journal of Materials Science: Materials in Electronics;2022-04-01