A study of heating rate and texture influences on annealing hillocks by a statistical characterization of Al thin‐film topography
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.342065
Reference28 articles.
1. A simple technique for eliminating hillocks in integrated circuit metallization
2. A method for eliminating hillocks in integrated-circuit metallizations
3. Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects
4. Hillock‐free integrated‐circuit metallizations by Al/Al‐O layering
5. In Situ Measurement of Stress. Included During Annealing, in A1-2%Cu Thin Films
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