Hillock‐free integrated‐circuit metallizations by Al/Al‐O layering
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.329343
Reference17 articles.
1. Hillock formation by surface diffusion on thin silver films
2. Thermal strain in lead thin films V: Strain relaxation above room temperature
3. Hillock growth in thin films
4. Hillock Growth on Vacuum Deposited Aluminum Films
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