Epitaxial ScxAl1−xN on GaN exhibits attractive high-K dielectric properties

Author:

Casamento Joseph1ORCID,Lee Hyunjea2,Maeda Takuya3ORCID,Gund Ved2ORCID,Nomoto Kazuki2,van Deurzen Len4ORCID,Turner Wesley5,Fay Patrick5ORCID,Mu Sai6ORCID,Van de Walle Chris G.6ORCID,Lal Amit2,Xing Huili (Grace)123ORCID,Jena Debdeep123ORCID

Affiliation:

1. Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853, USA

2. School of Electrical & Computer Engineering, Cornell University, Ithaca, New York 14853, USA

3. Kavli Institute at Cornell for Nanoscale Science, Cornell University, Ithaca, New York 14853, USA

4. School of Applied and Engineering Physics, Cornell University, Ithaca, New York 14853, USA

5. Department of Electrical Engineering, University of Notre Dame, South Bend, Indiana 46556, USA

6. Materials Department, University of California, Santa Barbara, California 93106-5050, USA

Abstract

Epitaxial Sc xAl1− xN thin films of ∼100 nm thickness grown on metal polar GaN substrates are found to exhibit significantly enhanced relative dielectric permittivity (εr) values relative to AlN. εr values of ∼17–21 for Sc mole fractions of 17%–25% ( x = 0.17–0.25) measured electrically by capacitance–voltage measurements indicate that Sc xAl1− xN has the largest relative dielectric permittivity of any existing nitride material. Since epitaxial Sc xAl1− xN layers deposited on GaN also exhibit large polarization discontinuity, the heterojunction can exploit the in situ high-K dielectric property to extend transistor operation for power electronics and high-speed microwave applications.

Funder

Defense Advanced Research Projects Agency

National Science Foundation

Air Force Office of Scientific Research

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

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