Graded composition and valence states in self-forming barrier layers at Cu–Mn/SiO2 interface
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3269602
Reference23 articles.
1. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
2. Effects of Ti addition on the morphology, interfacial reaction, and diffusion of Cu on SiO[sub 2]
3. Self-forming diffusion barrier layer in Cu–Mn alloy metallization
4. On the use of alloying elements for Cu interconnect applications
5. Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects
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