Analysis of local mechanical stresses in and near tungsten lines on silicon substrate
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.370151
Reference19 articles.
1. X‐ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines
2. Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits
3. High‐resolution determination of the stress in individual interconnect lines and the variation due to electromigration
4. Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment
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