Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1560851
Reference23 articles.
1. Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect
2. Copper interconnection integration and reliability
3. Thermal strain and stress in copper thin films
4. Stress development and relaxation in copper films during thermal cycling
5. Encapsulated copper interconnection devices using sidewall barriers
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