Stress Migration of Aluminum Backside Interconnect in Xtacking®
Author:
Affiliation:
1. Yangtze Memory Technologies Co., Ltd.,Wuhan,China,430205
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117817.pdf?arnumber=10117817
Reference15 articles.
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5. Evolution of stresses in passivated and unpassivated metal interconnects
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