Microscopic observation of Cu damascene interconnect grains using x-ray microbeam
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1398074
Reference20 articles.
1. Microtexture and electromigration-induced drift in electroplated damascene Cu
2. Key reliability issues for copper integration in damascene architecture
3. Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects
4. Texture and microstructure of thin copper films
5. Mechanical Properties of Electroplated Copper Thin Films
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