Texture and microstructure of thin copper films-Reference-Cited by-同舟云学术

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Texture and microstructure of thin copper films

Published:1993-06 Issue:6 Volume:22 Page:611-616
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Tracy D. P.,Knorr D. B.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02666406.pdf

Reference20 articles.

1. Microelectronic Packaging Handbook, eds. R.R. Tummula and E.J. Rymaszewski (Van Nostrand Reinhold, New York, 1989).

2. T. Ohmi and K. Tsubouchi,Solid State Techn. April 1992, 47.

3. H.-K. Kang, J.S.H. Cho and S.S. Wong,IEEE Electron Device Lett. 13, 448 (1992).

4. P.A. Flinn,J. Mater. Res. 6, 1498 (1991).

5. R.W. Herztberg,Deformation and Fracture Mechanics of Eng. Mater., 3rd ed. (John Wiley & Sons, New York, 1989), p. 15.

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