Copper electrodeposition in a magnetic field
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference29 articles.
1. Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects
2. Microscopic observation of Cu damascene interconnect grains using x-ray microbeam
3. Real Time Observation by Atomic Force Microscopy of Spontaneous Recrystallization at Room Temperature in Electrodeposited Copper Metallization
4. Self-annealing characterization of electroplated copper films
5. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
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