Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1527711
Reference27 articles.
1. Electromigration in copper conductors
2. Copper metallization reliability
3. Microtexture and electromigration-induced drift in electroplated damascene Cu
4. Electromigration path in Cu thin-film lines
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