Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1821626
Reference24 articles.
1. Anomalous Creep in Sn-Rich Solder Joints
2. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints
3. Creep behavior of eutectic Sn–Ag lead-free solder alloy
4. Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy
5. Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder
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1. Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
2. A critical review of constitutive models for solders in electronic packaging;Advances in Mechanical Engineering;2017-08
3. Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part I: Experiments;IEEE Transactions on Device and Materials Reliability;2016-09
4. Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications;Journal of Materials Science;2014-08-06
5. Impression test—A review;Materials Science and Engineering: R: Reports;2013-08
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