SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH-Reference-Cited by-同舟云学术

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SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH

Published:2016-02-28 Issue:8 Volume:119 Page:084101
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Zhang Xiaoxian¹^ORCID,Myers John N.¹^ORCID,Huang Huai²^ORCID,Shobha Hosadurga²,Chen Zhan¹,Grill Alfred³^ORCID

Affiliation:

1. Department of Chemistry, University of Michigan, 930 North University Avenue, Ann Arbor, Michigan 48109, USA

2. IBM Albany Nanotech, 257 Fuller Rd, Albany, New York 12203, USA

3. IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, New York 10598, USA

Funder

Semiconductor Research Corporation (SRC)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4942442

Reference41 articles.

1. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

2. Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization

3. Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from tetramethylsilane

4. Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition

5. Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps

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1. Probing molecular structures at buried solid/solid interfaces involving low-k materials or polymers in situ nondestructively: a review;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-03-02

2. Sum frequency spectroscopy studies on cell membrane fusion induced by divalent cations;Chinese Journal of Chemical Physics;2022-12-01

3. Probing protein aggregation at buried interfaces: distinguishing between adsorbed protein monomers, dimers, and a monomer–dimer mixture in situ;Chemical Science;2022

4. Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging;Journal of Electronic Packaging;2020-06-04

5. Understanding Molecular Structures of Buried Interfaces in Halide Perovskite Photovoltaic Devices Nondestructively with Sub‐Monolayer Sensitivity Using Sum Frequency Generation Vibrational Spectroscopy;Advanced Energy Materials;2019-11-26

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