Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps-Reference-Cited by-同舟云学术

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Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps

Published:2008-03 Issue:5 Volume:103 Page:054104
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Grill A.,Edelstein D.,Lane M.,Patel V.,Gates S.,Restaino D.,Molis S.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2844483

Reference10 articles.

1. Proceedings of the IEEE 2004 International Interconnect Technology Conference;Grill A.

2. Proceedings of the IEEE 2004 International Interconnect Technology Conference;Edelstein D.

3. Proceedings of the IEEE 2006 International Interconnect Technology Conference;McGahay V.

4. Advanced Metallization Conference;Gates S.,2006

5. Proceedings of IEDM;Sankaran S.,2006

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