Dielectric/metal sidewall diffusion barrier for Cu/porous ultralow-k interconnect technology
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1695205
Reference4 articles.
1. Simulations of diffusion barrier deposition on porous low-k films
2. COMPARATIVE STUDY OF IONIZED METAL PLASMA Ta, TaN AND MULTISTACKED Ta/TaN STRUCTURE AS DIFFUSION BARRIERS FOR Cu METALLIZATION
3. A comparative study of copper drift diffusion in plasma deposited a-SiC:H and silicon nitride
4. Diffusion barrier integrity and electrical performance of Cu/porous dielectric damascene lines
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