Buried, self-aligned barrier layer structures for perovskite-based memory devices comprising Pt or Ir bottom electrodes on silicon-contributing substrates
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.366761
Reference9 articles.
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4. Influence of Oxygen on the Iridium Silicide Formation by Rapid Thermal Annealing
5. Thermal stability of Ir/polycrystalline-Si structure for bottom electrode of integrated ferroelectric capacitors
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1. Science and technology of thin films and interfacial layers in ferroelectric and high-dielectric constant heterostructures and application to devices;Journal of Applied Physics;2006-09
2. Studies of thin film growth and oxidation processes for conductive Ti–Al diffusion barrier layers via in situ surface sensitive analytical techniques;Applied Physics Letters;2001-08-06
3. UHV Study of Hydrogen Atom Induced Etching of Amorphous Hydrogenated Silicon Thin Films;The Journal of Physical Chemistry B;2001-04-04
4. Correlation between oxidation resistance and crystallinity of Ti–Al as a barrier layer for high-density memories;Acta Materialia;2000-08
5. Bottom Electrode Structures of Pt/RuO2/Ru on Polycrystalline Silicon for Low Temperature (Ba,Sr)TiO3Thin Film Deposition;Japanese Journal of Applied Physics;1999-09-30
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