Thermal stability of Ir/polycrystalline-Si structure for bottom electrode of integrated ferroelectric capacitors
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.119581
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4. Surface Morphologies and Electrical Properties of(Ba,Sr)TiO3Films Prepared by Two-Step Deposition of Liquid Source Chemical Vapor Deposition
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1. Effect of hydrogen plasma on growth of Ir thin film by plasma-enhanced hybrid atomic layer deposition;Microelectronic Engineering;2012-10
2. INFLUENCE OF ADHESION LAYERS ON THE SURFACE MORPHOLOGY OF PLATINUM-BASED BOTTOM ELECTRODES FOR Pb(Zr,Ti)O3 THIN FILMS;Surface Review and Letters;2011-02
3. Atomic-layer-deposited Ir thin film as a novel diffusion barrier layer in Cu interconnection;physica status solidi (c);2010-11-23
4. Iridium CVD using di-µ-Chloro-tetrakis(trifluorophosphine)- diiridium (I) Precursor, in-situ generated from Chlorotetrakis(trifluorophosphine)iridium;Chemical Vapor Deposition;2009-12-07
5. Effect of annealing on thermal stability and morphology of pulsed laser deposited Ir thin films;Applied Surface Science;2008-04
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