Subject
Physics and Astronomy (miscellaneous)
Cited by
16 articles.
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1. Deep Interface Analysis by Neutron Beam;Journal of The Japan Institute of Electronics Packaging;2024-01-01
2. Semiconductor Wafer Bonding for Solar Cell Applications: A Review;Advanced Energy and Sustainability Research;2023-08-31
3. ウェハ接合界面における水分の影響;Journal of The Japan Institute of Electronics Packaging;2023-08-01
4. Hybrid Bonding for 3D Integration;Journal of The Japan Institute of Electronics Packaging;2023-07-01
5. Measurement of the bonding energy via non-planar direct bonding;Journal of Applied Physics;2023-06-01