Semiconductor Wafer Bonding for Solar Cell Applications: A Review

Abstract

Wafer bonding is a highly effective technique for integrating dissimilar semiconductor materials while suppressing the generation of crystalline defects that commonly occur during heteroepitaxial growth. This method is successfully applied to produce efficient solar cells, making it an important area of research for photovoltaic devices. In this article, a comprehensive review of semiconductor wafer‐bonding technologies is provided, focusing on their applications in solar cells. Beginning with an explanation of the thermodynamics of wafer bonding relative to heteroepitaxy, the functionalities and advantages of semiconductor wafer bonding are discussed. An overview of the history and recent developments in high‐efficiency multijunction solar cells using wafer bonding is also provided. Bonded solar cells made of various semiconductor materials are reviewed and various types of wafer‐bonding methods, including direct bonding and interlayer‐mediated bonding, are described. Additionally, other technologies that utilize wafer bonding, such as flexible cells, thin‐film transfer, and wafer reuse techniques, are covered.