Microstructures of phased-in Cr–Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.120224
Reference5 articles.
1. Investigation of multi-component lead-free solders
2. Studies of the SLT Chip Terminal Metallurgy
3. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
4. Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
5. SLT Device Metallurgy and its Monolithic Extension
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